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Ceppo LS66

Ceppo
Ceppo LS66 Ceppo LS66
Faced panel
Ceppo
LS66
SUPPORT: Chipboard, MDF
  • FORMAT: 5600 x 2070 mm
    THICKNESS: from 8 to 38 mm
    • TEXTURE ORIENTATION: Vertical
    BACK TEXTURE: Ceppo
    NOMINAL OVERTHICKNESS: +0.1 mm
Laminate
Ceppo
LS66
TYPE: HPL
  • FORMAT: 2760 x 2040 mm
    THICKNESS: 0.9 mm
Edge
Ceppo
LS66
TYPE: ABS
  • HEIGHT: from 15 to 330 mm
    THICKNESS: from 0.5 to 2.5 mm

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